Strong glue able to withstand higher temperatures.
* 100% New Heatsink plaster.
* Application:
apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET HeatsinkŒHigh power LED,VGA CARD Northbridge
Southbridge Heatsink.
* Features: thermal properties,
strong adhesion
* Melting capacity: 0 (200 / 24Hours)
* Evaporation: 0.001% (200 / 24Hours)
* Thermal conductivity:gt; 1.2W/m-K
* Thermal Impedance: lt;0.06
* Clotting time: 3min (25 )
* Strength of connected buildings: 25Kg
* Insulation coefficientgt; 5.1
* Dissipation coefficient lt;0.005
*
Temperature resistance: 200